Technology

Our modern technology and experienced personnel are responsible for our high quality products!

We use modern technology controlled by experienced employees in order to produce products of the highest standards.

Production of printed circuit boards is split into several phases

1st
phase

After we’ve received all the data from the client, we process them and start production.

2nd
phase

First we prepare films that are used in the production of printed circuit boards.

3rd
phase

Then, holes in the board are drilled.

4th
phase

Next is the first “Black hole” metallization. When the holes are drilled, they have to be treated so that their walls can be coated with copper (they have to be conductive on all sides). This is achieved with a machine called the “Black Hole” (the name originates from chemistry).

5th
phase

In the following phase the board is laminated. With a special method, both sides of the board are coated with a photosensitive foil. Then, client’s films are placed on the board, which must match perfectly – all holes must be covered. When films are in place and exposed to UV light, they are developed – electronic components and holes are opened (copper is now visible), everything else remains covered with foil.

6th
phase

During the next phase, electronic components and holes are coated with copper (20 to 25 microns of copper) and later tin (protection against etching). Next the film or the photosensitive foil are removed and the boards are sent off for etching.

7th
phase

In the areas covered with foil copper is still present, and is now being etched. But in the areas where tin has been applied to the board, the board can’t be etched (tin is etch resistant).

8th
phase

Next up is the removal of tin. Once tin has been removed, the printed circuit board is already functional and in a case of emergency (if you are in desperate hurry), it can already be used.

9th
phase

The board is then varnished on both sides; the machine applies varnish in a thin jet at a predetermined speed. The board is prepared for exposure to UV light with client’s film. Then it is dried for an hour and a half at 150 degrees. Once the varnish hardens, the board is selectively tinned.

10th
phase

All apertures are again tinned (hot tinning).

11th
phase

Boards are screen printed or legend print is added, since boards are mostly labelled (as to where individual elements will be placed).

12th
phase

Boards are electrically tested to make sure that no error has occurred.

13th
phase

In this last phase the boards are cut.